This paper discusses the advantages and limitations of liquid crystal thermography for providing the information required for the development of deterministic numerical models of nucleate boiling. Examples are given of studies of localised events that dep

This paper reports the development of embedded droplet impingement for integrated cooling of electronics (EDIFICE). The EDIFICE project seeks to develop an integrated droplet impingement cooling device for removing chip heat fluxes in the range 70–100 W/cm2, employing latent heat of vaporization of dielectric fluids (50–100 μm droplets) to achieve these high heat removal rates. Micro-manufacturing and micro electro-mechanical systems (MEMS) will be discussed as enabling technologies for innovative cooling schemes recently proposed. A novel feature to enable adaptive on-demand cooling is MEMS sensing (on-chip temperature, remote IR temperature and ultrasonic dielectric film thickness) and MEMS actuation. EDIFICE will be integrated within the electronics package and fabricated using advanced micro-manufacturing technology (e.g., deep reactive ion etching (DRIE) and complementary metal-oxide-semiconductor (CMOS) CMU-MEMS). The development of EDIFICE involves modeling, CFD simulations, and physical experimentation on test beds.