DocumentCode
20573
Title
A Selective Encapsulation Solution For Packaging An Optical Micro Electro Mechanical System
Author
Richard D. Sisson Jr. استاد راهنما , Isa Bar-On استاد مشاور
University
WPI
Grade
نامعلوم
Major
MS )Materials Science Engineering(
Number of pages
0
Publish Date
2002
Keyword
die bow , encapsulant , encapsulate , electrochemical migration , wirebonds , micro electro mechanical systems , Packaging , die warpage , ELECTRONICS , MEMS , Corrosion
Note
01
Language
انگليسي
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