DocumentCode
4459
Title
Development of Convective Solder Reflow and Projection Moire System and FEA Model for PWBA Warpage Prediction
Author
C. P. Wong استاد مشاور , I. Charles Ume استاد راهنما , Jiahui Pan استاد مشاور
University
Georgia Institute Of Technology
Grade
دكتري
Major
Doctor of Philosophy
Number of pages
0
Publish Date
2006
Keyword
Computational fluid dynamics , PWBA , projection moire , warpage , Finite element , Measurement , Prediction , segmentation , snakes , convective solder reflow , active contours , FEA
Note
01
Language
انگليسي
Link To Document