DocumentCode
4524
Title
Study of thermally reworkable epoxy materials and thermal conductivity enhancement using carbon fiber for electronics packaging
Author
C.P. Wong استاد راهنما
University
Georgia Institute Of Technology
Grade
دكتري
Major
Doctor of Philosophy
Number of pages
0
Publish Date
2003
Keyword
Electronic packaging Materials , epoxy resins , electric conductivity , Constraints )Physics( , Drugs Design.
Note
01
Language
انگليسي
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