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A Modification for Steady Junction Temperature of IGBT Modules Considering Thermal Coupling

محمد عبداله , عباس هوشمند ویكی , محمد توكلی بینا

Power electronics , IGBT module , junction temperature , finite element method (FEM) , thermal coupling , reliability

ايران

امید علوی

Power electronics,IGBT module,junction temperature,finite element method (FEM),thermal coupling,reliability