Improving the mechanical properties of Poly Nanofibres applicable for skin burn dressing

Skin burn dressing is an urgent clinical problem. Although significant advances have been made in treatment, there are several challenges associated with traditional methods, e.g., limited donor skin tissue for skin transplantation, inflammation during long term healing time. In this study we present a method to fabricate nanofibres using electro- spinning. The method developed here could lead to a new dressing material for treatment of skin wounds. To address these challenges, in this study we present a method to fabricate Poly (ethylene-co-vinyl alcohol) (EVOH) nanofibres encapsulated with Ag nanoparticle using electro-spinning. The fibres were fabricated with controlled diameters (in the range of 59 nm – 3 µm) by regulating three main electrospinning parameters, i.e., EVOH solution concentration, the electric voltage and the distance between the injection needle tip (high voltage point) and the fibre collector. Ag was added to the nanofibres to offer long term anti-inflammation effect by controlled release of Ag nanoparticles through gradual degradation of EVOH nanofibre. In this study, we try to explore on new dressing materials to get a better clinical properties to deal with the problems associated with existing woven and non-woven materials currently used in skin wound treatment. The new produced nanofibres network let to permeation of water molecules through the dressing to regulate the moisture level at the wounds surface, an important fact to promote cell growth and reduce inflammation. The large fibrous system also allows drugs, e.g., antibacterial or cell growth promoters, to be retained within the structure to control infections and facilitate new growths. In addition, materials of proven biocompatibility and bio-decomposability can be selected for fibres to allow for slow release of the drugs. The advantage of the presented method leads to less frequency in dressing replacement and a better environment for heeling.