شماره ركورد كنفرانس :
4561
عنوان مقاله :
Thermal Analysis of Sintered Silver Nanoparticles Film
Author/Authors :
Mahdi Keikhaie Department of Mechanical Engineering - Center of Excellence in Design, Robotics and Automation - Sharif University of Technology, Tehran , Javad Akbari Micro Mechanism Research Group - Department of Engineering Design and Manufacture - Center of Advanced Manufacturing and Material Processing - Faculty of Engineering - University of Malaya, Malaysia , Mohammad R Movahhedy Department of Mechanical Engineering - Center of Excellence in Design, Robotics and Automation - Sharif University of Technology, Tehran , Hamid Alemohammad Department of Mechanical and Mechatronics Engineering - University of Waterloo, Canada
كليدواژه :
Thin film , Nanoparticles , Pore , Effective thermal conductivity
عنوان كنفرانس :
The Bi-Annual International Conference on Experimental Solid Mechanics and Dynamics ۲۰۱۴
چكيده لاتين :
Thin bonded films have many applications in coating and semiconductor industries. Thermal conductivity is one of the important parameter for power packaging since the thermal resistance of the interconnections is directly related to the heat removal capability and thermal management of the power package. The defects in materials play very important role on the effective thermal conductivity. In this paper, finite element method (FEM) was utilized to simulate the effect of pores on the effective thermal conductivity of sintered silver nanoparticles film. The simulation results indicate that the effective thermal conductivity of film is different at different directions and would be enhanced when the pore angle is 90. The simulation results will help us to further understand the heat transfer process across highly porous structures and will provide us a powerful guide to design coating with high thermal insulation or conductor property.
