شماره ركورد كنفرانس :
5041
عنوان مقاله :
Improving Thermal Resistance of a Commercial Silicon Resin through Distribution of Hollow Silica Nanospheres
Author/Authors :
A. Khoshoie Institute of Nano Science and Nano Technology - University of Kashan, Kashan, Iran , R. Golhosseini Department of Chemical Engineering - Faculty of Engineering - University of Kashan, Kashan, Iran , A. Mohammadrezaei Research and Development Group - Exir Novin Farayand Asia Company, Tehran, Iran
كليدواژه :
Silicone resin , Hollow Silica Nanospheres , Thermal degradation , Fire resistance
عنوان كنفرانس :
The 10th International Chemical Engineering Congress & Exhibition (IChEC 2018)
چكيده فارسي :
فاقد چكيده فارسي
چكيده لاتين :
In this study, Hollow Silica Nanospheres (HSNS) is fabricated for improving thermal properties of a commercial silicon resin. Sample of HSNS powder with ratios of 10wt% and 30wt% is spread through a commercial silicon resin (SILIKOPHEN○ P80/X) by using ultrasound radiation. Hence, a template-assisted wet chemical method was used to prepare HSNS. Creation of HSNSs in the range of 20-50 nm was proved by TEM analysis. Besides, Thermal properties of silicon resin containing HSNS investigated with thermogravimetric analysis (TGA). By increasing amount of HSNS up to 30 wt. % the temperature of first stage of degradation increased from 365 to 400 °C while the second one improved from 465 to 490 °C. The residual value in TGA analysis at 600 °C for pure silicon resin, silicon resin of 10wt% and 30 wt. % HSNS were 43.04%, 47.82% and 73.83%, respectively. Improving thermal resistance of commercial silicon resin were observed by adding ceramic Silica Nanospheres. In fact, by adding HSNS to silicon resin, degradation of silicon resin decreased.
