Author/Authors
DIENOT, Jean-Marc University Paul Sabatier, France
Title Of Article
Investigations On Electromagnetic Noises and Interactions in Electronic Architectures A Tutorial Case on a Mobil System
شماره ركورد
35333
Abstract
Electromagnetic interactions become critic in embedded and smart electronic structures. The increase of electronic performances confined in a finite volume or support for mobile applications defines new electromagnetic environment and compatibility configurations (EMC). With canonical demonstrators developed for tutorials and EMC experiences, this paper present basic principles and experimental techniques to investigate and control these severe interferences. Some issues are reviewed to present actual and future scientific challenges for EMC at electronic circuit level.
From Page
58
NaturalLanguageKeyword
Electromagnetic Compatibility , Emission , Coupling , Susceptibility , Immunity , Noise , Aggression , Embedded , Chip , Printed Circuit Board (PCB) , Wire , Packaging , Near , field , TEM
JournalTitle
Mediterranean Telecommunications Journal
To Page
73
JournalTitle
Mediterranean Telecommunications Journal
Link To Document