• DocumentCode
    1000570
  • Title

    Time dependence of interface trap formation in MOSFETs following pulsed irradiation

  • Author

    Saks, N.S. ; Dozier, C.M. ; Brown, D.B.

  • Author_Institution
    US Naval Res. Lab., Washington, DC, USA
  • Volume
    35
  • Issue
    6
  • fYear
    1988
  • fDate
    12/1/1988 12:00:00 AM
  • Firstpage
    1168
  • Lastpage
    1177
  • Abstract
    The time dependence of interference trap (Nit) formation in MOSFETs was studied as a function of gate oxide thickness, oxide growth type, substrate orientation, temperature, and gate bias. Two different Nit formation mechanisms are observed. Most (typically 90%) of the formation, called the late process, occurs slowly at long times (1-10000 s) after the radiation pulse. From a variety of experimental data, it is concluded that the rate of the late process is limited by drift of a radiation-induced positive ion, probably H+ , through the gate oxide to the Si-SiO2 interface where the Nit are formed. A relatively fast, or early, process is responsible for a small percentage of the total Nit formation. The time constant for this process appears to be consistent with hole drift through the oxide
  • Keywords
    electron beam effects; insulated gate field effect transistors; interface electron states; semiconductor device testing; MOSFETs; Si-SiO2 interface; early process; electron irradiation; gate bias; gate oxide thickness; hole drift; interface trap formation; late process; oxide growth type; pulsed irradiation; radiation-induced positive ion; substrate orientation; temperature dependence; time constant; time dependence; Aluminum; Atomic measurements; Bonding; Hardware design languages; Hydrogen; Ionizing radiation; Laboratories; MOSFETs; Production; Silicon;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/23.25435
  • Filename
    25435