DocumentCode
1000570
Title
Time dependence of interface trap formation in MOSFETs following pulsed irradiation
Author
Saks, N.S. ; Dozier, C.M. ; Brown, D.B.
Author_Institution
US Naval Res. Lab., Washington, DC, USA
Volume
35
Issue
6
fYear
1988
fDate
12/1/1988 12:00:00 AM
Firstpage
1168
Lastpage
1177
Abstract
The time dependence of interference trap (Nit) formation in MOSFETs was studied as a function of gate oxide thickness, oxide growth type, substrate orientation, temperature, and gate bias. Two different Nit formation mechanisms are observed. Most (typically 90%) of the formation, called the late process, occurs slowly at long times (1-10000 s) after the radiation pulse. From a variety of experimental data, it is concluded that the rate of the late process is limited by drift of a radiation-induced positive ion, probably H+ , through the gate oxide to the Si-SiO2 interface where the Nit are formed. A relatively fast, or early, process is responsible for a small percentage of the total Nit formation. The time constant for this process appears to be consistent with hole drift through the oxide
Keywords
electron beam effects; insulated gate field effect transistors; interface electron states; semiconductor device testing; MOSFETs; Si-SiO2 interface; early process; electron irradiation; gate bias; gate oxide thickness; hole drift; interface trap formation; late process; oxide growth type; pulsed irradiation; radiation-induced positive ion; substrate orientation; temperature dependence; time constant; time dependence; Aluminum; Atomic measurements; Bonding; Hardware design languages; Hydrogen; Ionizing radiation; Laboratories; MOSFETs; Production; Silicon;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/23.25435
Filename
25435
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