DocumentCode
1009397
Title
Manipulation of microparticles using new modes of traveling-wave-dielectrophoretic forces: numerical Simulation and experiments
Author
Fu, Lung-Ming ; Lee, Gwo-Bin ; Lin, Yen-Heng ; Yang, Ruey-Jen
Author_Institution
Graduate Inst. of Mater. Eng., Nat. Pingtung Univ. Sci. & Technol., Pintung, Taiwan
Volume
9
Issue
2
fYear
2004
fDate
6/1/2004 12:00:00 AM
Firstpage
377
Lastpage
383
Abstract
This paper presents a microchip device which uses traveling-wave-dielectrophoretic (twDEP) forces for the manipulation of microparticles and yeast cells. The dielectrophoretic forces generated under different operating conditions are simulated numerically, and the electric field distributions, force distributions and microparticle traces are investigated thoroughly. The paper presents two innovative modes of microparticle manipulation using positive (only one electrode is active at any instant in time, while the other three electrodes are all switched off) and negative (one electrode is "off", and the other electrodes are "on") dielectrophoretic forces. Micromachining techniques are used to fabricate micro-twDEP chips. The capability of electrode arrays in manipulating bioparticles is demonstrated by driving yeast cells in a suspension medium. The current experimental data confirm that dielectrophoretic forces can be used successfully for the collection, alignment, step-wise movement and general manipulation of cells.
Keywords
biocontrol; biological techniques; electric field effects; electric fields; electrodes; electrophoresis; integrated circuit manufacture; micromachining; suspensions; electric field distributions; electrode; force distributions; micromachining techniques; microparticles manipulation; microtwDEP chips; traveling-wave-dielectrophoretic forces; yeast cells; Councils; Dielectrophoresis; Educational institutions; Electrodes; Fungi; Instruments; Micromachining; Micromechanical devices; Numerical simulation; Sampling methods;
fLanguage
English
Journal_Title
Mechatronics, IEEE/ASME Transactions on
Publisher
ieee
ISSN
1083-4435
Type
jour
DOI
10.1109/TMECH.2004.828649
Filename
1306451
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