• DocumentCode
    10105
  • Title

    PowerField: A Probabilistic Approach for Temperature-to-Power Conversion Based on Markov Random Field Theory

  • Author

    Seungwook Paek ; Wongyu Shin ; Jaehyeong Sim ; Lee-Sup Kim

  • Author_Institution
    Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
  • Volume
    32
  • Issue
    10
  • fYear
    2013
  • fDate
    Oct. 2013
  • Firstpage
    1509
  • Lastpage
    1519
  • Abstract
    Temperature-to-power technique is useful for post-silicon power model validation. However, the previous works were applicable only to the steady-state analysis. In this paper, we propose a new temperature-to-power technique, named PowerField, supporting both transient and steady-state analysis based on a probabilistic approach. Unlike the previous works, PowerField uses two consecutive thermal images to find the most feasible power distribution that causes the change between the two input images. To obtain the power map with the highest probability, we adopted maximum a posteriori Markov random field (MAP-MRF). For MAP-MRF framework, we modeled the spatial thermal system as a set of thermal nodes and derived an approximated transient heat transfer equation that requires only the local information of each thermal node. Experimental results with a thermal simulator show that PowerField outperforms the previous method in transient analysis reducing the error by half on average. We also show that our framework works well for steady-state analysis by using two identical steady-state thermal maps as inputs. Lastly, an application to determining the binary power patterns of an FPGA device is presented achieving 90.7% average accuracy.
  • Keywords
    Markov processes; heat transfer; infrared imaging; maximum likelihood estimation; power conversion; power measurement; transient analysis; FPGA device; MAP-MRF; PowerField; approximated transient heat transfer equation; binary power patterns; maximum a posteriori Markov random field; post-silicon power model validation; power distribution; power map; spatial thermal system; steady-state analysis; temperature-to-power conversion; thermal images; thermal node; transient analysis; Equations; Heating; Mathematical model; Steady-state; Temperature measurement; Thermal resistance; Transient analysis; Graph cuts; Markov random field; post-silicon power validation; temperature-to-power;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2013.2272542
  • Filename
    6600867