DocumentCode :
1011958
Title :
Bipolar transistor fabrication using selective epitaxial growth of P- and B-doped layers in gas-source Si molecular beam epitaxy
Author :
Hirayama, Hiroyuki ; Koyama, Kazuhisa ; Tatsumi, Toru
Author_Institution :
NEC Corp., Kawasaki, Japan
Volume :
11
Issue :
1
fYear :
1990
Firstpage :
18
Lastpage :
20
Abstract :
Si n-p-n bipolar transistor fabrication using selective epitaxial growth in disilane gas-source Si molecular beam epitaxy (Si-MBE) is discussed. Selective growth of B-doped and P-doped Si was used for the base- and emitter-layer formation, respectively. The growth temperature was 600 degrees C. No ion-implantation process was used. The base ohmic contact was formed using Al selective chemical vapor deposition. The fabricated transistor showed normal emitter-base and base-collector I-V characteristics. The common-emitter characteristics revealed a maximum current gain of 30.<>
Keywords :
bipolar transistors; boron; molecular beam epitaxial growth; phosphorus; semiconductor doping; semiconductor growth; 600 degC; Al selective chemical vapor deposition; Si bipolar transistor; Si n-p-n bipolar transistor fabrication; Si/sub 2/H/sub 6/; Si:B; Si:P; base layer formation; base ohmic contact; base-collector I-V characteristics; common-emitter characteristics; disilane gas-source; emitter-base I-V characteristics; emitter-layer formation; growth temperature; maximum current gain; molecular beam epitaxy; selective epitaxial growth; Artificial intelligence; Bipolar transistors; Chemical vapor deposition; Doping; Epitaxial growth; Fabrication; Molecular beam epitaxial growth; Scanning electron microscopy; Surface cleaning; Temperature;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.46917
Filename :
46917
Link To Document :
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