Title :
Analyzing the Value of Using Three-Dimensional Electronics for a High-Performance Computational System
Author :
Mountain, David J.
Author_Institution :
Center for Exceptional Comput., Adelphi
Abstract :
A detailed analysis of using three-dimensional electronics (3DE) to build a high-performance computational system has been completed. The overall goals were to maximize system performance, minimize system redesign, and optimize 3DE costs. Reliable and high-quality power distribution was identified as the most critical technical issue, with thermal effects being important as well. The use of 3-D vias on a standard grid is shown to be a valuable design option. A 3DE-based system using a three-tier 3DIC design (called a 3DC64) was defined and evaluated. Raw performance for the 3DC64 is expected to be up to 2 that of the current system (2DC64). The 3DC64 also demonstrated clear improvements in more critical metrics such as operations/watt and operations/dollar. Based on this analysis, some suggestions for research initiatives and optimum use of 3DE are made.
Keywords :
circuit CAD; integrated circuit economics; integrated circuit packaging; 2DC64; 3DC64; high-performance computational system; high-quality power distribution; integrated circuit economics; integrated circuit packaging; three-dimensional electronics; Computer performance; integrated circuit economics; integrated circuit packaging; three-dimensional integrated circuits (3-D ICs);
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2007.909457
