DocumentCode

1014152

Title

Thermal-compression bonded contacts in large area silicon diodes

Author

Mellor, H.L.

Author_Institution

Bell Telephone Laboratories, Inc., Allentown, Pa.

Volume

6

Issue

2

fYear

1959

fDate

4/1/1959 12:00:00 AM

Firstpage

252

Lastpage

252

Keywords

Alloying; Bonding; Cathodes; Detectors; Diodes; Electrodes; Germanium; Gold; Indium; Nitrogen; Silicon; Soldering; Temperature;

fLanguage

English

Journal_Title

Electron Devices, IRE Transactions on

Publisher

ieee

ISSN

0096-2430

Type

jour

DOI

10.1109/T-ED.1959.14535

Filename

1472578