Title :
The ELSA wafer scale integration project
Author_Institution :
Dept. of Electron. & Electr. Eng., Sheffield Univ., UK
fDate :
11/1/1993 12:00:00 AM
Abstract :
Outlines some of the technology, successful and unsuccessful, of part of a large European project in wafer scale integration (WSI). The work described is an attempt to build a 64 by 64 array processor on a 4-in wafer. Such a processor would have a computing power in excess of 10 billion operations per second. A test chip and a demonstration system, which achieves such a processing power, is also described
Keywords :
VLSI; microprocessor chips; parallel architectures; ELSA wafer scale integration project; array processor; computing power; demonstration system; parallel processing; test chip; Application software; Computer architecture; Hardware; Helium; Packaging; Prototypes; Silicon; Software tools; System testing; Wafer scale integration;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
