Title :
Mechanism of lead failures in thermocompression bonds
Author_Institution :
Bell Telephone Laboratories, Inc., Murray Hill, N. J.
Keywords :
Aging; Aluminum; Bonding; Electrons; Gold; Grain boundaries; Laboratories; Lead compounds; Magnetic field measurement; Magnetic switching; Plasma measurements; Switches; Telephony; Wire;
Journal_Title :
Electron Devices, IRE Transactions on
DOI :
10.1109/T-ED.1962.15046
