DocumentCode
1022657
Title
Ti added Nb3 Sn wires by new fabrication processes
Author
Kohno, O. ; Ikeno, Y. ; Sadakata, N. ; Sugimoto, M. ; Agatsuma, K. ; Kaiho, K.
Author_Institution
Fujikura Ltd., Koto-ku, Tokyo, Japan
Volume
23
Issue
2
fYear
1987
fDate
3/1/1987 12:00:00 AM
Firstpage
964
Lastpage
967
Abstract
The new fabrication processes for Ti addition to Nb3 Sn have been developed. Using the pure Ti around Nb cores and sufficient Sn by internal plating, we have been able to get the good workability during drawing to a final diameter and the high critical current density at a higher field than 14 T. Several characteristics of both Ti foil and Ti rod processes have been discussed about the effect of Ti addition to Nb3 Sn.
Keywords
Superconducting filaments/wires; Annealing; Copper; Critical current density; Fabrication; Laboratories; Niobium; Niobium-tin; Tin; Wire; Workability;
fLanguage
English
Journal_Title
Magnetics, IEEE Transactions on
Publisher
ieee
ISSN
0018-9464
Type
jour
DOI
10.1109/TMAG.1987.1064879
Filename
1064879
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