• DocumentCode
    1024409
  • Title

    Adaptive Neuro-Fuzzy Inference System Modeling of MRR and WIWNU in CMP Process With Sparse Experimental Data

  • Author

    Lih, Wen-Chen ; Bukkapatnam, Satish T S ; Rao, Prahalad ; Chandrasekharan, Naga ; Komanduri, Ranga

  • Author_Institution
    Oklahoma State Univ., Taoyuan
  • Volume
    5
  • Issue
    1
  • fYear
    2008
  • Firstpage
    71
  • Lastpage
    83
  • Abstract
    Availability of only limited or sparse experimental data impedes the ability of current models of chemical mechanical planarization (CMP) to accurately capture and predict the underlying complex chemomechanical interactions. Modeling approaches that can effectively interpret such data are therefore necessary. In this paper, a new approach to predict the material removal rate (MRR) and within wafer nonuniformity (WIWNU) in CMP of silicon wafers using sparse-data sets is presented. The approach involves utilization of an adaptive neuro-fuzzy inference system (ANFIS) based on subtractive clustering (SC) of the input parameter space. Linear statistical models were used to assess the relative significance of process input parameters and their interactions. Substantial improvements in predicting CMP behaviors under sparse-data conditions can be achieved from fine-tuning membership functions of statistically less significant input parameters. The approach was also found to perform better than alternative neural network (NN) and neuro-fuzzy modeling methods for capturing the complex relationships that connect the machine and material parameters in CMP with MRR and WIWNU, as well as for predicting MRR and WIWNU in CMP.
  • Keywords
    adaptive systems; chemical mechanical polishing; fuzzy neural nets; fuzzy reasoning; fuzzy set theory; fuzzy systems; pattern clustering; planarisation; semiconductor device manufacture; statistical analysis; CMP process; MRR; WIWNU; adaptive neuro-fuzzy inference system modeling; chemical mechanical planarization; complex chemomechanical interaction; linear statistical model; material removal rate; membership function; silicon wafer; sparse experimental data; subtractive clustering; Adaptive systems; Costs; Manufacturing industries; Neural networks; Planarization; Predictive models; Random access memory; Semiconductor device modeling; Silicon; Surface morphology; Adaptive neuro-fuzzy inference system (ANFIS); chemical mechanical planarization (CMP); neural network (NN);
  • fLanguage
    English
  • Journal_Title
    Automation Science and Engineering, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1545-5955
  • Type

    jour

  • DOI
    10.1109/TASE.2007.911683
  • Filename
    4418328