• DocumentCode
    1031111
  • Title

    Winner: Semiconductors The Ultimate Dielectrics is ... Nothing

  • Author

    Adee, Sarah

  • Volume
    45
  • Issue
    1
  • fYear
    2008
  • Firstpage
    39
  • Lastpage
    42
  • Abstract
    This paper presents IBM air gap technology, in which wires are placed in vacuum to speed chips and save power.
  • Keywords
    air gaps; isolation technology; microprocessor chips; air gap technology; dielectric isolation; microprocessor chips; Air gaps; Cable insulation; Dielectrics; Glass; Performance gain; Printed circuits; Production; Vacuum technology; Wires; Wiring;
  • fLanguage
    English
  • Journal_Title
    Spectrum, IEEE
  • Publisher
    ieee
  • ISSN
    0018-9235
  • Type

    jour

  • DOI
    10.1109/MSPEC.2008.4428312
  • Filename
    4428312
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1031111