Title :
Thermocompression bonding of external package leads on integrated circuit substrates
fDate :
6/1/1968 12:00:00 AM
Keywords :
Assembly; Bonding forces; Copper; Gold; Integrated circuit packaging; Integrated circuit yield; Joining processes; Metallization; Silicon devices; Testing;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/T-ED.1968.16267
