Title :
Cooling characteristics of diamond-shaped interrupted cooling fin for high-power LSI devices
Author :
Kishimoto, T. ; Saski, S.
Author_Institution :
NTT, Electronics & Mechanics Technology Laboratories, Musashino, Japan
Abstract :
We propose a diamond-shaped interrupted microgrooved cooling fin to decrease the junction temperature variation across the chip. The analytical result indicates that the junction temperature variation decreses to less than 25% compared with a conventional paralles-plate-shaped cooling fins. This cooling structure is sufficient to cool high-power-consumption silicon chips.
Keywords :
VLSI; cooling; heat sinks; large scale integration; power integrated circuits; VLSI cooling; cooling characteristics; cooling structure; diamond-shaped interrupted microgrooved cooling fin; heat sinks; high-power LSI devices; high-power-consumption silicon chips; junction temperature variation;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19870328
