• DocumentCode
    10335
  • Title

    Influence of Implantation Damages and Intrinsic Dislocations on Phosphorus Diffusion in Ge

  • Author

    Yujiao Ruan ; Chengzhao Chen ; Shihao Huang ; Wei Huang ; Songyan Chen ; Cheng Li ; Jun Li

  • Author_Institution
    Dept. of Phys., Xiamen Univ., Xiamen, China
  • Volume
    60
  • Issue
    11
  • fYear
    2013
  • fDate
    Nov. 2013
  • Firstpage
    3741
  • Lastpage
    3745
  • Abstract
    Influence of the implant-induced damages and the threading dislocations during germanium (Ge) epitaxy was investigated on the phosphorus diffusion in Ge. An adequate n-type junction was formed by 650°C rapid thermal annealing of the implanted bulk Ge. It is observed that for epitaxial Ge on Si substrate, there was an enhanced local phosphorus diffusion approaching the Ge/Si interface. A diffusion model considering the enhancement by defects is proposed to sufficiently explain the phosphorus diffusion profiles in Ge. The intrinsic dislocation-enhanced phosphorus diffusivity found at least three orders of magnitude larger than that in the absence of dislocations.
  • Keywords
    diffusion; dislocations; elemental semiconductors; germanium; ion implantation; phosphorus; rapid thermal annealing; semiconductor doping; semiconductor epitaxial layers; Si; Si substrate; Si-Ge:P; diffusion model; germanium epitaxy; implantation damages; intrinsic dislocations; n-type junction; phosphorus diffusion; rapid thermal annealing; threading dislocations; Annealing; Epitaxial growth; Germanium; Semiconductor process modeling; Substrates; Germanium (Ge); implantation damage; phosphorus diffusion; threading dislocation;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2280382
  • Filename
    6600887