• DocumentCode
    104
  • Title

    An improved analytical method to design CMUTs with square diaphragms

  • Author

    Rahman, Mosaddequr ; Hernandez, Jaime ; Chowdhury, Shuvro

  • Author_Institution
    Univ. of Windsor, Windsor, ON, Canada
  • Volume
    60
  • Issue
    4
  • fYear
    2013
  • fDate
    Apr-13
  • Firstpage
    834
  • Lastpage
    845
  • Abstract
    A highly accurate mathematical method has been presented for analytical characterization of capacitive micromachined ultrasonic transducers (CMUTs) built with square diaphragms. The method uses a new two-dimensional polynomial function to more accurately predict the deflection curve of a multilayer square diaphragm subject to both mechanical and electrostatic pressure and a new capacitance model that takes into account the contribution of the fringing field capacitances. Both of the models have been experimentally verified by comparing the models predicted values with measurement results and are found to be in excellent agreement with a maximum deviation of less than 2% for experimentally measured capacitance values. 3-D electromechanical finite element analysis (FEA) for a wide range of material properties, geometric specifications, and loading conditions show that the presented method is highly consistent in accuracy over the typical square-diaphragm CMUT design space.
  • Keywords
    capacitance; capacitive sensors; finite element analysis; geometry; micromachining; polynomials; pressure; ultrasonic transducers; 3D electromechanical finite element analysis; FEA; capacitance model; capacitance value; capacitive micromachined ultrasonic transducer; deflection curve; electrostatic pressure; geometric specification; loading condition; material properties; mathematical method; maximum deviation; mechanical pressure; multilayer square diaphragm; square-diaphragm CMUT design space; two-dimensional polynomial function;
  • fLanguage
    English
  • Journal_Title
    Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-3010
  • Type

    jour

  • DOI
    10.1109/TUFFC.2013.2632
  • Filename
    6489818