Title :
Creep of solder interconnects under combined loads
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA
fDate :
12/1/1993 12:00:00 AM
Abstract :
An exact analysis is presented for the creep deformation of solder interconnects subjected to the actions of bending moment and axial force. Dimensionless interaction curves and charts which relate the variables, axial force, location of neutral-axis, maximum bending stress and strain rate, bending moment and change in curvature rate are provided for engineering practice convenience. The tangent-modulus buckling loads of centrally loaded solder columns and a simple formula for the critical time to buckling are determined. The constitutive relationship of the solder interconnects is given
Keywords :
creep; deformation; soldering; axial force; bending moment; buckling; centrally loaded solder columns; combined loads; creep deformation; critical time; curvature rate; dimensionless interaction curves; engineering practice convenience; exact analysis; maximum bending stress; neutral-axis; solder interconnects creep; strain rate; tangent-modulus buckling loads; Annealing; Capacitive sensors; Creep; Electronics packaging; Materials testing; Mathematical model; Plastics; Steady-state; Stress; Temperature;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
