Evaluation of tumbling processes of multilayer ceramic capacitors for surface mount device applications

Author

Hiremath, Basavaraj V.

Author_Institution

AT&T Bell Labs., Princeton, NJ, USA

Volume

16

Issue

8

fYear

1993

fDate

12/1/1993 12:00:00 AM

Firstpage

822

Lastpage

827

Abstract

During a tumbling process, sharp corners of multilayer ceramic chip capacitors are rounded to obtain smooth corners. The sharp corners of chip capacitors are susceptible to breakage during pick and place machine operation used in surface mount technologies. Tumbling of chip capacitors minimizes such breakage. The author describes various tumbling processes and their effect on electrical properties and life test performance of 0.1 μF lead based multilayer capacitors, in 0905, 1005, and 1206 sizes. In conclusion, this study recommends a tumbling process involving bisque fired capacitors over other processes for lead based multilayer capacitors. A short discussion on the general methodology of the tumbling process is included

Keywords

capacitors; ceramics; electron device manufacture; electron device testing; life testing; sintering; surface mount technology; 0.1 muF; 0905 size; 1005 size; 1206 size; MLC chip capacitors; bisque fired capacitors; corner breakage; electrical properties; lead based multilayer capacitors; life test performance; multilayer ceramic capacitors; smooth corners; surface mount device applications; tumbling processes; Ball milling; Capacitors; Ceramics; Firing; Helium; Life testing; Minerals; Nonhomogeneous media; Printed circuits; Resistors;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.273680

Filename

273680