Correlation of analytical and experimental approaches to determine thermally induced PWB warpage

Author

Yeh, Chao-pin ; Ume, Charles ; Fulton, Robert E. ; Wyatt, Karl W. ; Stafford, John W.

Author_Institution

Res. Center, Motorola Inc., Schaumburg, IL, USA

Volume

16

Issue

8

fYear

1993

fDate

12/1/1993 12:00:00 AM

Firstpage

986

Lastpage

995

Abstract

Thermomechanical design effects in the printed wiring board (PWB) design process are considered, In particular, a research project for developing advanced finite-element method (FEM)-oriented capabilities to simulate thermally induced PWB warpage is reported. The FE analysis results are validated by correlating them with measurements obtained from a separate experimental approach using the shadow Moire method

Keywords

deformation; finite element analysis; printed circuit design; sensitivity analysis; stress-strain relations; thermal expansion; thermal stresses; FE analysis; FEA; FEM-oriented capabilities; PCB; PWB design process; finite-element method; printed wiring board; thermally induced PWB warpage; thermomechanical design effects; Electronic packaging thermal management; Finite element methods; Integrated circuit packaging; Manufacturing; Process design; Soldering; Surface-mount technology; Thermal conductivity; Thermomechanical processes; Wiring;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.273701

Filename

273701