Title :
Uniqueness in activation energy and charge-to-breakdown of highly asymmetrical DRAM Al2O3 cell capacitors
Author :
Banerjee, Parag ; Ditali, Akram
Author_Institution :
Micron Technol. Inc., Boise, ID, USA
Abstract :
Al2O3 cell capacitors for dynamic random access memory (DRAM) applications were tested using constant voltage, time-dependent dielectric breakdown (TDDB) tests. The capacitors had area-enhancing, hemispherical grain (HSG) polysilicon as bottom electrodes (BEs). These electrodes acted as points of high electric field, and eased charge injection into the Al2O3. As a result, the capacitors had highly asymmetric current-voltage (I-V) characteristics. Time-to-fails (TTFs) were polarity-dependent, and, thus, much worse for HSG injection. However, activation energy (Ea) and charge-to-breakdown (QBD) obtained from conducting stress under opposite polarities were a unique function of the electric field only. The results point to a common, polarity-independent mechanism responsible for final breakdown, and the possibility that only the kinetics of degradation is electrode controlled. Good correlation with the thermochemical E model suggests that the breakdown mechanism in Al2O3 might be similar to SiO2.
Keywords :
DRAM chips; aluminium compounds; capacitors; silicon compounds; voltage control; Al2O3; DRAM applications; DRAM cell capacitors; HSG injection; HSG polysilicon; I-V characteristics; SiO2; TDDB tests; activation energy; area-enhancing polysilicon; bottom electrodes; charge injection; charge-to-breakdown; constant voltage; degradation kinetics; dynamic random access memory; electrode control; hemispherical grain; highly asymmetric current-voltage; highly asymmetrical DRAM; polarity-dependent; polarity-independent mechanism; thermochemical E model correlation; thermochemical model; time-dependent dielectric breakdown; time-to-fails; Breakdown voltage; Capacitors; DRAM chips; Design for quality; Dielectric breakdown; Electric breakdown; Electrodes; Random access memory; Testing; Thermal stresses; $; $E_a$; $hbox Al_2 hbox O_; Activation energy; DRAM; QBD; TDDB; cell capacitors; charge-to-breakdown; dynamic random access memory; thermochemical model; time-dependent dielectric breakdown;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2004.831900