DocumentCode :
1046603
Title :
Effects of ionization rates on IMPATT device admittance
Author :
Seddik, M.M. ; Haddad, G.I.
Author_Institution :
University of Michigan, Ann Arbor, Mich.
Volume :
20
Issue :
12
fYear :
1973
fDate :
12/1/1973 12:00:00 AM
Firstpage :
1164
Lastpage :
1168
Abstract :
The significance of using different ionization rates on the operating characteristics of Si IMPATT devices is examined. The dc breakdown and small-signal results of IMPATT devices at room temperature are presented. Numerical results for p+nn+as well as the complementary n+pp+Si diodes in the millimeter-wave frequency range and at different current densities ranging from 2500 to 10 000 A/cm2are given. It is shown that large differences in some important device parameters are obtained, depending on the ionization rates employed.
Keywords :
Admittance; Aluminum; Annealing; Boron; Capacitance; Etching; Ion implantation; Ionization; Resistors; Resists;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/T-ED.1973.17814
Filename :
1477471
Link To Document :
بازگشت