DocumentCode
104664
Title
Similarity Searching for Defective Wafer Bin Maps in Semiconductor Manufacturing
Author
Chung-Shou Liao ; Tsung-Jung Hsieh ; Yu-Syuan Huang ; Chen-Fu Chien
Author_Institution
Dept. of Ind. Eng. & Eng. Manage., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Volume
11
Issue
3
fYear
2014
fDate
Jul-14
Firstpage
953
Lastpage
960
Abstract
Because high-dimensional wafer bin maps (WBMs) cause various features, it is difficult to search the similarity among WBMs via conventional pattern recognition methods. This study develops a novel morphology-based support vector machine for defective wafer detection. The experimental results demonstrate its usefulness in yield improvements on precision and computation cost.
Keywords
pattern recognition; production engineering computing; semiconductor device manufacture; semiconductor device reliability; support vector machines; WBM; defective wafer bin maps; defective wafer detection; morphology-based support vector machine; pattern recognition methods; semiconductor manufacturing; Fabrication; Morphology; Pattern recognition; Support vector machines; Testing; Training; Data mining; morphology; semiconductor manufacturing; similarity search; support vector machines; wafer bin maps;
fLanguage
English
Journal_Title
Automation Science and Engineering, IEEE Transactions on
Publisher
ieee
ISSN
1545-5955
Type
jour
DOI
10.1109/TASE.2013.2277603
Filename
6587837
Link To Document