DocumentCode
104802
Title
Silicon-Based White LED Packaging Module With an Integrated RGB Color Sensor
Author
Chunyu Chen ; Chingfu Tsou
Author_Institution
Dept. of Autom. Control Eng., Feng Chia Univ., Taichung, Taiwan
Volume
27
Issue
5
fYear
2015
fDate
March1, 1 2015
Firstpage
553
Lastpage
556
Abstract
This letter presents a silicon-based light-emitting diode (LED) packaging module with integrated red, green, and blue (RGB) color sensors, which can detect the variations in the brightness and specified wavelength intensity of white LEDs to evaluate the chromaticity and color temperature of emitting light in real time. The carrier substrate with color sensors was fabricated by semiconductor manufacturing technology and a deep silicon etching process was used to complete electrical division and thermal isolation. By integrating blue LED and silicone phosphor, a monolithic packaging module with miniaturization and low cost was achieved. A typical experimental result shows the output currents of the RGB color sensors as 0.082, 0.086, and 0.068 mA, respectively, when the input current to the LED is 0.2 A. The calculated chromaticity coordinates of x and y are 0.35 and 0.36, respectively, and the corresponding color temperature is 4852 K. These experimental results are consistent with the measurements of a commercial luminous meter.
Keywords
brightness; etching; image sensors; integrated optics; light emitting diodes; light sources; optical fabrication; phosphors; silicon; silicones; blue LED; brightness; carrier substrate; chromaticity coordinates; color temperature; commercial luminous meter; current 0.068 mA; current 0.082 mA; current 0.086 mA; current 0.2 A; deep silicon etching process; electrical division; emitting light; input current; integrated RGB color sensor; miniaturization; monolithic packaging module; output currents; semiconductor manufacturing technology; silicon-based light-emitting diode packaging module; silicone phosphor; temperature 4852 K; thermal isolation; wavelength intensity; white LED; Color; Current measurement; Light emitting diodes; Packaging; Phosphors; Temperature measurement; Temperature sensors; LED packaging; color sensor; silicon;
fLanguage
English
Journal_Title
Photonics Technology Letters, IEEE
Publisher
ieee
ISSN
1041-1135
Type
jour
DOI
10.1109/LPT.2014.2385066
Filename
6994752
Link To Document