• DocumentCode
    105190
  • Title

    Accurate Modeling of Quality Factor Behavior of Complex Silicon MEMS Resonators

  • Author

    Ghaffari, Shirin ; Ng, Eldwin Jiaqiang ; Chae Hyuck Ahn ; Yushi Yang ; Shasha Wang ; Hong, Vu A. ; Kenny, Thomas W.

  • Author_Institution
    Apple Inc., Cupertino, CA, USA
  • Volume
    24
  • Issue
    2
  • fYear
    2015
  • fDate
    Apr-15
  • Firstpage
    276
  • Lastpage
    288
  • Abstract
    The quality factor of a resonator represents the decay of vibrational energy over time, and is directly related to the frequency response and other key parameters that determine performance of inertial sensors and oscillators. Accurate prediction of the quality factor is essential for designing high-performance microelectromechanical (MEMS) devices. Several energy dissipation mechanisms contribute to the quality factor. Due to computational complexity, highly simplified models for the dominant dissipation mechanism, such as Zener´s model for thermoelastic dissipation (TED), are often employed. However, the intuition provided by these models is inadequate to predict the quality factor of more complex designs and can be highly misleading. In this paper, we construct complete, quantitative, and predictive models with finite-element methods for the intrinsic energy dissipation mechanisms in MEMS resonators using full anisotropic representation of crystalline silicon and the temperature dependence of all parameters. We find that TED is often a more significant source of damping than has been assumed, because of the previously neglected role of crystalline anisotropy and small geometric features, such as etch release holes-all of which can now be included in practical models. We show that these models, along with simpler scaling models for extrinsic dissipation mechanisms, explain measurements of quality factor in diverse sets of MEMS resonators with unprecedented accuracy. [2014-0106]
  • Keywords
    Q-factor; micromechanical resonators; microsensors; thermoelasticity; Si; complex silicon MEMS resonators; crystalline anisotropy; extrinsic dissipation mechanisms; high-performance microelectromechanical devices; intrinsic energy dissipation mechanisms; quality factor; thermoelastic dissipation; Computational modeling; Damping; Mathematical model; Q-factor; Silicon; Temperature dependence; Temperature measurement; Capacitive sensors; Q-factor; damping; energy dissipation; frequency response; frequency-domain analysis; geometry; internal friction; microelectromechanical devices; microelectromechanical systems (MEMS); micromechanical resonators; physics; quality factor; resonance; thermal-mechanical coupling; thermal-mechanical coupling.; thermoelastic dissipation;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2014.2374451
  • Filename
    6994789