• DocumentCode
    1059634
  • Title

    SFQ Propagation Properties in Passive Transmission Lines Based on a 10-Nb-Layer Structure

  • Author

    Takagi, Katsumi ; Tanaka, Masamitsu ; Iwasaki, Shingo ; Kasagi, Ryo ; Kataeva, Irina ; Nagasawa, Shuichi ; Satoh, Tetsuro ; Akaike, Hiroyuki ; Fujimaki, Akira

  • Author_Institution
    Nagoya Univ., Nagoya, Japan
  • Volume
    19
  • Issue
    3
  • fYear
    2009
  • fDate
    6/1/2009 12:00:00 AM
  • Firstpage
    617
  • Lastpage
    620
  • Abstract
    We have studied single-flux-quantum (SFQ) propagation properties in passive transmission lines (PTLs) based on a 10-Nb-layer device structure (ADP2). In ADP2, we can use the PTLs with a line width about 5 mum, one seventh of conventional line width by adopting a strip line (SL) structure and increasing the characteristic impedance. The evaluation has been conducted on the PTL length and the via-hole structure by using ring oscillators. We found that the decrease in the operating region was larger for longer PTL, compared with that in a conventional device structure (STD2). The results would be caused by the increase in the surface resistance. The via-holes connecting the PTLs on different layers have more complicated structure than those of STD2. We have designed the via-hole structure using the electromagnetic wave simulator HFSS. As a result, we have demonstrated sufficiently large operating margins at any data rates up to 80 Gb/s even for the ring oscillator with 30 via-holes.
  • Keywords
    oscillators; strip lines; superconducting logic circuits; superconducting microwave devices; superconducting transmission lines; SFQ propagation properties; characteristic impedance; conventional device structure; electromagnetic wave simulator; layer device structure; passive transmission lines; ring oscillators; single-flux-quantum propagation properties; strip line structure; surface resistance; Passive transmission line; single flux quantum (SFQ) logic; strip line; via-hole;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2009.2019130
  • Filename
    5067097