• DocumentCode
    106204
  • Title

    Broadband and High-Isolation Dual-Polarized Microstrip Antenna With Low Radar Cross Section

  • Author

    Si-Jia Li ; Jun Gao ; Xiangyu Cao ; Zhao Zhang ; Di Zhang

  • Author_Institution
    Inf. & Navig. Coll., PLA Air Force Eng. Univ., Xi´an, China
  • Volume
    13
  • fYear
    2014
  • fDate
    2014
  • Firstpage
    1413
  • Lastpage
    1416
  • Abstract
    A Ku-band dual-linear polarized broadband aperture-coupled antenna with high-isolation and low radar cross section (RCS) in special direction is presented, fabricated, and measured based on substrate integrated waveguide technology. The substrate-integrated rows of metallized via holes (SIRMHs) are inserted into the conventional aperture-coupled antenna to enhance the isolation and improve the impedance matching. Monostatic RCS is reduced because the surface current of the metallized ground plane is guided by the SIRMHs. The theoretical and experimental results are in good agreement. Experimental results indicated that the isolation is more than 40 dB, the bandwidth obtains 21% of return loss less than -20 dB, and the RCS is reduced to as much as 23 dB from 12.2 to 16 GHz compared to a traditional antenna when incident angle is 30 °.
  • Keywords
    aperture-coupled antennas; microstrip antennas; radar antennas; radar cross-sections; substrate integrated waveguides; Ku-band dual linear polarized broadband aperture coupled antenna; SIRMHs; conventional aperture coupled antenna; high isolation dual polarized microstrip antenna; impedance matching; low radar cross section; metallized ground plane; monostatic RCS; substrate integrated rows of metallized via holes; substrate integrated waveguide technology; Antenna measurements; Bandwidth; Broadband antennas; Frequency measurement; Microstrip antennas; Substrates; Dual-polarization antenna; isolation; radar cross section (RCS) reduction; substrate integrated waveguide technology;
  • fLanguage
    English
  • Journal_Title
    Antennas and Wireless Propagation Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1536-1225
  • Type

    jour

  • DOI
    10.1109/LAWP.2014.2339933
  • Filename
    6862839