Title :
Plastic Encapsulated Signal and Power Transistor Reliability
Author :
Herr, E.A. ; Fox, A. ; Read, J.S.
Author_Institution :
Semiconductor Products Department General Electric Company
fDate :
5/1/1974 12:00:00 AM
Abstract :
Since the introduction of solid encapsulated epoxy signal transistors by General Electric in 1962, substantial improvements have been made in plastic materials and packaging techniques resulting in a homogeneous solid package for semiconductor components. These advances, reflected in an excellent performance record in consumer and industrial equipments, have led to the extended use of these devices in industrial and some military applications where high reliability is demanded.
Keywords :
Assembly; Defense industry; Electrical equipment industry; Packaging machines; Plastic packaging; Power transistors; Semiconductor device reliability; Silicon; Solids; Thermal stresses;
Journal_Title :
Broadcast and Television Receivers, IEEE Transactions on
DOI :
10.1109/TBTR1.1974.299822