DocumentCode
1065147
Title
Silver Migration in Glass Dams between Silver-Palladium Interconnections
Author
Kahan, George J.
Author_Institution
IBM System Products Assurance, Poughkeepsie, N.Y.
Issue
3
fYear
1975
Firstpage
86
Lastpage
94
Abstract
It is shown that two mechanisms are encountered in metal migration in glass-a platelike and treelike growth mechanism. The treelike growth, requiring a much higher interfacial energy contribution, is favored by high voltage application. The interaction of these two mechanisms accounts for the unexpected voltage and gap dependence of the niigration rate. The location of the metallic growth has been established as being in the volume of the glass. Significant differences exist in the electrical characteristics of the substrates of different manufacturers. After the application of glass dams these differences become less pronounced.
Keywords
Aluminum oxide; Ceramics; Conductivity; Electric variables; Electrodes; Glass; Humidity; Low voltage; Manufacturing; Silver;
fLanguage
English
Journal_Title
Electrical Insulation, IEEE Transactions on
Publisher
ieee
ISSN
0018-9367
Type
jour
DOI
10.1109/TEI.1975.297881
Filename
4080296
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