Title :
Analysis of Calibrated On-Chip Temperature Sensor With Process Compensation for HV Chips
Author :
Chua-Chin Wang ; Wen-Je Lu ; Tsung-Yi Tsai
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Abstract :
This brief presents a wide-range temperature sensor with process compensation and nonlinear calibration for HV chip thermal monitoring. Due to a high supply voltage and a large current, HV chips are prone to overheating; thus, they require on-chip temperature sensors to monitor thermal variation. The voltage difference between the drain and source voltages of a metal-oxide-semiconductor, i.e., VDS, of HV devices is enlarged by high supply voltages, causing a severe channel length modulation effect to jeopardize the linearity of the saturation current. The proposed calibrated temperature sensors in this brief provide a nonlinear calibration function to resolve this problem. Moreover, our design reveals a process compensation capability by the proposed process variation canceler. The maximal deviation in the range of (-40°C, +150)°C is measured to be -2.05°C-+2.06°C.
Keywords :
calibration; temperature sensors; thermal management (packaging); HV chips; HV devices; VDS; metal-oxide-semiconductor; nonlinear calibration function; on-chip temperature sensor; process compensation; temperature -2.05 C to 2.06 C; temperature -40 C; temperature 150 C; thermal monitoring; Linearity; Modulation; Resistors; System-on-chip; Temperature distribution; Temperature measurement; Temperature sensors; Calibrated temperature sensor; calibrated temperature sensor; channel length modulation effect; non-linear calibration; nonlinear calibration; process compensation;
Journal_Title :
Circuits and Systems II: Express Briefs, IEEE Transactions on
DOI :
10.1109/TCSII.2014.2362734