• DocumentCode
    10670
  • Title

    Investigating the Intrinsic Noise Limit of Dayem Bridge NanoSQUIDs

  • Author

    Patel, T. ; Li, Bing ; Gallop, J. ; Cox, D. ; Kirkby, K. ; Romans, E. ; Chen, Jiann-Jong ; Nisbet, A. ; Hao, Liangliang

  • Author_Institution
    Nat. Phys. Lab., Teddington, UK
  • Volume
    25
  • Issue
    3
  • fYear
    2015
  • fDate
    Jun-15
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    NanoSQUIDs made from Nb thin films have been produced with nanometre loop sizes down to 200 nm, using weak-link junctions with dimensions less than 60 nm. These composite (W/Nb) single layer thin film devices, patterned by FIB milling, show extremely good low-noise performance ~170 nΦo at temperatures between 5 and 8.5 K and can operate in rather high magnetic fields (at least up to 1 T) . The devices produced so far have a limited operating temperature range, typically only 1-2 K. We have the goal of achieving operation at 4.2 K, to be compatible with the best SQUID series array (SSA) preamplifier available. Using the SSA to readout the nanoSQUIDs provides us with a means of investigating the intrinsic noise of the former. In this paper we report improved white noise levels of these nanoSQUIDs, enabling potential detection of a single electronic spin flip in a 1-Hz bandwidth. At low frequencies the noise performance is already limited by SSA preamplifier noise.
  • Keywords
    SQUIDs; focused ion beam technology; metallic thin films; milling; niobium; superconducting device noise; superconducting microbridges; Dayem bridge; FIB milling; Nb; SQUID series array; bandwidth 1 Hz; electronic spin flip; intrinsic noise limit; nanoSQUID; temperature 1 K to 2 K; temperature 4.2 K; temperature 5 K to 8.5 K; thin films; weak link junctions; Critical current density (superconductivity); Junctions; Nanoscale devices; Niobium; Noise; Preamplifiers; SQUIDs; $T_{c}$ suppression; NanoSQUIDs; T; noise measurements; suppression;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2014.2364920
  • Filename
    6936295