Improvement of High-Current Density PCB Design With PSU Load Balance and Redundancy on a High End Server System

Power efficiency and utilization are important factors for a cloud service provider. In this paper, we provide one quick design method both for a high-current density power distribution printed circuit board (PCB) design and for an improvement of a high end server system. This design method also takes into consideration both load balance and failures of a multipower supply server system, when the server system is supported by a redundancy power source. Our design is based on a system power source to sink the current path for both PCB copper shape dimension and thickness design, and to add some power or ground via for stitching either each power or ground plane on a multilayer PCB design to reduce direct current resistance. It also considers the airflow necessary for cooling the power distribution board to lower the temperature rise when high current is delivered with a resulting lower power loss and higher power efficiency and performance per watt.