Electrical insulation design and withstand test of model coils for 6.6 kV class HTSFCL

Author

Baek, Seung-Myeong ; Joung, Jong-Man ; Kim, Sang-Hyun

Author_Institution

Dept. of Electr. Eng., Gyeongsang Nat. Univ. & Eng. Res. Inst., Jinju, South Korea

Volume

14

Issue

2

fYear

2004

fDate

6/1/2004 12:00:00 AM

Firstpage

843

Lastpage

846

Abstract

Electrical design and withstand test of mini-model coils for high temperature superconducting fault current limiter (HTSFCL) have been studied. Electrical insulating factors of the HTS coil for HTSFCL are turn-to-turn and layer-to-layer. The electrical insulation of turn-to-turn depends on surface length, and the electrical insulation of layer-to-layer depends on surface length and breakdown strength of LN₂. Therefore, two basic characteristics of breakdown and flashover voltage were experimentally investigated to design electrical insulation for 6.6 kV Class HTSFCL. We used Weibull distribution to get electric field strength for insulation design. And mini-model coils for HTSFCL were designed by using Weibull distribution and were manufactured to investigate breakdown characteristics. The mini-model coils were passed in impulse withstand test as well as AC withstand test.

Keywords

Weibull distribution; fault current limiters; high-temperature superconductors; insulator testing; power transformer insulation; superconducting coils; superconducting device testing; 6.6 kV; AC withstand test; HTS coil; Weibull distribution; breakdown strength; breakdown voltage; electric field strength; electrical insulating factors; electrical insulation design; flashover voltage; high temperature superconducting fault current limiter; impulse withstand test; mini-model coils; surface length; Breakdown voltage; Dielectrics and electrical insulation; Electric breakdown; Fault current limiters; High temperature superconductors; Impulse testing; Insulation testing; Superconducting coils; Superconducting epitaxial layers; Weibull distribution; Electrical insulation design; HTSFCL; layer-to-layer; turn-to-turn; withstand test;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/TASC.2004.830294

Filename

1324924