DocumentCode :
1070108
Title :
Silicon carbide FETs for high temperature nuclear environments
Author :
Scozzie, C.J. ; McGarrity, J.M. ; Blackburn, J. ; DeLancey, W.M.
Author_Institution :
US Army Res. Lab., Adelphi, MD, USA
Volume :
43
Issue :
3
fYear :
1996
fDate :
6/1/1996 12:00:00 AM
Firstpage :
1642
Lastpage :
1648
Abstract :
SiC transistors can operate at very high temperatures and survive very high radiation doses. These characteristics make SiC potentially the ideal technology for nuclear power applications. In this paper we report, for the first time, on the active in-core irradiation of 6H-SiC depletion-mode junction field-effect transistors (IFETs) at 25° and 300°C in a nuclear reactor operated at 200 kW. No significant degradation in the device characteristics was observed until the total neutron fluence exceeded 1015 n/cm2 for irradiation at 25°C, and no significant changes were observed even at 5×1015 n/cm2 at 300°C. The results of this experiment may also indicate exciting evidence for the anneal of neutron displacement damage for devices irradiated at 300°C
Keywords :
field effect transistor circuits; fission reactor instrumentation; neutron effects; radiation hardening (electronics); silicon compounds; 200 kW; 25 C; 300 C; 6H-SiC depletion-mode junction field-effect transistors; IFET; SiC; SiC FETs; SiC transistors; active in-core irradiation; anneal; degradation; high radiation doses; high temperature nuclear environments; neutron displacement damage; nuclear power applications; total neutron fluence; Annealing; Circuits; Doping; Etching; FETs; JFETs; Neutrons; Silicon carbide; Substrates; Temperature;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/23.507163
Filename :
507163
Link To Document :
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