Title :
Diagnosis of a cause of life test failure in alloy diodes
Author :
Kingsnorth, Roland
Author_Institution :
Mullard Ltd., Southampton, Hampshire, United Kingdom
fDate :
12/1/1980 12:00:00 AM
Abstract :
Removal of silicon by CF4/O2plasma etching combined with optical microscope and SEM examinations of the exposed aluminum surface have been used to determine that the cause of life test failure in aluminum/silicon-alloy diodes was the presence of traces of alkali metal in the aluminum pellets used.
Keywords :
Aluminum; Circuit testing; Electron devices; Life testing; Optical distortion; Scanning electron microscopy; Semiconductor device testing; Semiconductor diodes; Silicon; Solid state circuits;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/T-ED.1980.20271
