Optimizing Thermal Sensor Allocation for Microprocessors

High-performance microprocessor families employ dynamic-thermal-management techniques to cope with the increasing thermal stress resulting from peaking power densities. These techniques operate on feedback generated from on-die thermal sensors. The allocation and the placement of thermal-sensing elements directly impact the effectiveness of the dynamic management mechanisms. In this paper, we propose systematic techniques for determining the optimal locations for thermal sensors to provide high-fidelity thermal monitoring of a complex microprocessor system. Our strategies can be divided into two main categories: uniform sensor allocation and nonuniform sensor allocation. In the uniform approach, the sensors are placed on a regular grid. The nonuniform allocation identifies an optimal physical location for each sensor such that the sensor´s attraction toward steep thermal gradients is maximized, which can result in uneven concentrations of sensors on different locations of the chip. We also present a hybrid algorithm that shows the tradeoffs associated with number of sensors and expected accuracy. Our experimental results show that our uniform approach using interpolation can detect the chip temperature with a maximum error of 5.47degC and an average maximum error of 1.05degC . On the other hand, our nonuniform strategy is able to create a sensor distribution for a given microprocessor architecture, providing thermal measurements with a maximum error of 3.18degC and an average maximum error of 1.63degC across a wide set of applications.