Title :
Current Limiting Properties of MOD-YBCO Thin Films Stabilized With High-Resistivity Alloy Shunt Layer
Author :
Furuse, M. ; Yamasaki, H. ; Manabe, T. ; Sohma, M. ; Kondo, W. ; Yamaguchi, I. ; Kumagai, T. ; Kaiho, K. ; Arai, K. ; Nakagawa, M.
Author_Institution :
Nat. Inst. of Adv. Ind. Sci. & Technol., Tsukuba
fDate :
6/1/2007 12:00:00 AM
Abstract :
Switching power densities of current limiting elements consisting of metal organic deposition YBa2Cu3O7 (MOD-YBCO) thin films with high-resistivity Au-Ag alloy shunt layers and non-inductive Manganin resistors are evaluated. Despite the non-uniform critical current density distribution in MOD-YBCO films, the use of a high-resistivity Au-Ag shunt layer allows MOD-YBCO-based elements to achieve switching power densities comparable to those obtained for elements based on co-evaporated YBCO thin films. The present MOD-YBCO-based elements are capable of withstanding electric fields of 46 V/cm with a switching power density of 2.0 kVA/cm2. These results indicate that low cost MOD-YBCO thin films are promising for practical fault current limiters. In addition, relationships between the uniformity of Jc distribution and current limiting properties are also discussed.
Keywords :
MOCVD; barium compounds; critical current density (superconductivity); electrical resistivity; fault current limiters; gold alloys; high-temperature superconductors; silver alloys; superconducting thin films; thin film resistors; yttrium compounds; AuAg-YBa2Cu3O7; MOD-YBCO thin films; coevaporated thin films; current limiting property; high-resistivity alloy shunt layers; metal organic deposition; noninductive Manganin resistors; nonuniform critical current density; switching power density; Costs; Current limiters; High temperature superconductors; Resistors; Shunt (electrical); Sputtering; Superconducting films; Superconducting transmission lines; Transistors; Yttrium barium copper oxide; Fault current limiter; YBCO thin film; metal organic deposition; shunt layer;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2007.898349