• DocumentCode
    1075460
  • Title

    Sub-100-nm current-perpendicular-to-plane sensor fabrication

  • Author

    Zheng, Y.K. ; Li, K.B. ; Qiu, J.J. ; Han, G.C. ; Guo, Z.B. ; Zong, B.Y. ; An, L.H. ; Luo, P. ; Liu, Z.Y. ; Wu, Y.H.

  • Author_Institution
    Data Storage Inst., Singapore, Singapore
  • Volume
    40
  • Issue
    4
  • fYear
    2004
  • fDate
    7/1/2004 12:00:00 AM
  • Firstpage
    2248
  • Lastpage
    2250
  • Abstract
    Two sets of processes for sub-100-nm current-perpendicular-to-plane (CPP) spin-valves (SVs) were developed. In the first method, a CPP SV was fabricated by using via-hole instead of small cell patterning. This method makes it easy to characterize the CPP spin valve films. The shunting effect has been analyzed in this method. In the second method, a resist layer for planarization, ion-milling, and wet etching for self-opening via-hole in a self-aligned fashion by making use of the height difference between the cell and surrounding regions was introduced. This method is suitable for the actual recording heads with small dimension even without an ion-beam-deposition system. CPP sensors with size from 0.05 μm·0.05 μm to 0.4 μm· 0.5 μm with different free- layer structures have been investigated by means of the first method.
  • Keywords
    giant magnetoresistance; magnetic sensors; perpendicular magnetic recording; spin valves; 100 nm; CPP sensors; CPP spin valve films; cell patterning; current-perpendicular-to-plane sensor fabrication; free-layer structures; giant magnetoresistance effect; height difference; ion milling; ion-beam-deposition system; probe recording; recording heads; resist layer; self-opening via-hole; shunting effect; small dimension; via hole; wet etching; Electrodes; Fabrication; Giant magnetoresistance; Insulation; Magnetic heads; Magnetic sensors; Memory; Probes; Resists; Wet etching; CPP; Current-perpendicular-to-plane; GMR; SV; effect; giant magnetoresistance; probe recording; spin-valve;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/TMAG.2004.830204
  • Filename
    1325467