Title :
Special issue on High-Performance Multi-Chip Interconnections
fDate :
6/1/2009 12:00:00 AM
Abstract :
Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers.
Journal_Title :
Circuits and Systems II: Express Briefs, IEEE Transactions on
DOI :
10.1109/TCSII.2009.2024259
