Plasma processing

Author

Graves, David B.

Author_Institution

Dept. of Chem. Eng., California Univ., Berkeley, CA, USA

Volume

22

Issue

1

fYear

1994

fDate

2/1/1994 12:00:00 AM

Firstpage

31

Lastpage

42

Abstract

Low pressure, non-equilibrium, weakly to partially ionized gas discharge plasmas are used for a variety of surface materials processing applications. The most extensive applications are in microelectronics manufacturing, where plasma sputtering, etching, stripping, cleaning and film deposition play key roles in this growing industry. Up to 30% of all process steps in integrated circuit manufacture involve low pressure plasmas in one way or another. The rapid pace of process and product technological change in this industry, coupled with the unique capabilities of plasma processing for extremely finely controlled surface modification, offers new opportunities to plasma scientists

Keywords

discharges (electric); integrated circuit manufacture; plasma CVD; plasma applications; sputter etching; surface treatment; integrated circuit manufacture; low pressure plasmas; microelectronics manufacturing; partially ionized gas discharge plasmas; plasma cleaning; plasma etching; plasma film deposition; plasma sputtering; plasma stripping; surface materials processing applications; surface modification; Cleaning; Integrated circuit manufacture; Integrated circuit technology; Manufacturing industries; Microelectronics; Plasma applications; Plasma materials processing; Sputter etching; Sputtering; Surface discharges;

fLanguage

English

Journal_Title

Plasma Science, IEEE Transactions on

Publisher

ieee

ISSN

0093-3813

Type

jour

DOI

10.1109/27.281547

Filename

281547