DocumentCode :
107778
Title :
Finite Element Analysis of Ring-on-Ring Test on LCD Panels
Author :
Vepakomma, K.H. ; Westbrook, Jamie ; Carley, Stephen ; Jum Kim
Author_Institution :
Corning Inc., Corning, NY, USA
Volume :
9
Issue :
8
fYear :
2013
fDate :
Aug. 2013
Firstpage :
673
Lastpage :
677
Abstract :
The ring-on-ring test is one of the most popular surface strength testing methods used to test LCD panels. This paper uses finite element analysis to show that a panel behaves like two independent pieces of glass during a ring-on-ring test. The epoxy region where the color filter and thin-film transistor (TFT) glasses are glued together does not affect the stress at the center. As LCD panels get thinner, the contribution of membrane stress increases significantly. Because the color filter and TFT glasses act independently, they experience maximum principal stresses within 15% of each other. For deflections greater than one-half (sometimes one-fourth) the glass thickness, the stresses are not uniform inside the load ring, requiring finite element analysis to obtain an accurate stress distribution.
Keywords :
colour displays; finite element analysis; liquid crystal displays; membranes; optical filters; optical glass; stress analysis; thin film transistors; LCD panel testing; TFT; color filter; epoxy region; finite element analysis; maximum principal stress; membrane stress distribution; ring-on-ring testing; surface strength testing method; thin-film transistor glass; Ceramics; Finite element analysis; Glass; Stress; System-on-chip; Testing; Thin film transistors; Finite element analysis; LCD panel; ROR; ring-on-ring (ROR) test; surface strength testing; thin glass;
fLanguage :
English
Journal_Title :
Display Technology, Journal of
Publisher :
ieee
ISSN :
1551-319X
Type :
jour
DOI :
10.1109/JDT.2013.2251744
Filename :
6487419
Link To Document :
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