Title :
Characterization of positive resist development
Author :
O´Toole, M.M. ; Grande, W.J.
Author_Institution :
Hewlett Packard Laboratories, Palo Alto, CA
fDate :
12/1/1981 12:00:00 AM
Abstract :
The development of positive photoresist is assumed to be a surface limited reaction whose development rate is determined by the local inhibitor concentration M, as defined by Dill et al. This paper describes a technique for determining development rate as a function of inhibitor concentration and demonstrates the usefulness of the technique for quality control. Resist development parameters for the simulation of line edge profiles in resist are presented.
Keywords :
Annealing; Doping; Gallium arsenide; Glass; Implants; Inhibitors; Integrated circuit measurements; Resists; Thickness measurement; Wavelength measurement;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/EDL.1981.25446