DocumentCode :
1078168
Title :
Characterization of positive resist development
Author :
O´Toole, M.M. ; Grande, W.J.
Author_Institution :
Hewlett Packard Laboratories, Palo Alto, CA
Volume :
2
Issue :
12
fYear :
1981
fDate :
12/1/1981 12:00:00 AM
Firstpage :
311
Lastpage :
313
Abstract :
The development of positive photoresist is assumed to be a surface limited reaction whose development rate is determined by the local inhibitor concentration M, as defined by Dill et al. This paper describes a technique for determining development rate as a function of inhibitor concentration and demonstrates the usefulness of the technique for quality control. Resist development parameters for the simulation of line edge profiles in resist are presented.
Keywords :
Annealing; Doping; Gallium arsenide; Glass; Implants; Inhibitors; Integrated circuit measurements; Resists; Thickness measurement; Wavelength measurement;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/EDL.1981.25446
Filename :
1481930
Link To Document :
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