Title :
Circuit models for power bus structures on printed circuit boards using a hybrid FEM-SPICE method
Author :
Guo, Chunlei ; Hubing, Todd H.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Missouri-Rolla, Rolla, MO
Abstract :
Power bus structures consisting of two parallel conducting planes are widely used on high-speed printed circuit boards. In this paper, a full-wave finite-element method (FEM) method is used to analyze power bus structures, and the resulting matrix equations are converted to equivalent circuits that can be analyzed using SPICE programs. Using this method of combining FEM and SPICE, power bus structures of arbitrary shape can be modeled efficiently both in the time-domain and frequency-domain, along with the circuit components connected to the bus. Dielectric loss and losses due to the finite resistance of the power planes can also be modeled. Practical examples are presented to validate this method
Keywords :
SPICE; finite element analysis; frequency-domain analysis; power electronics; printed circuits; time-domain analysis; SPICE analysis; circuit component; circuit models; dielectric loss; equivalent circuits; finite resistance loss; frequency-domain modeling; full-wave finite-element method; hybrid FEM-SPICE method; power bus structures; printed circuit boards; time-domain modeling; Dielectric losses; Equations; Equivalent circuits; Finite element methods; Matrix converters; Printed circuits; SPICE; Shape; Time domain analysis; Transmission line matrix methods; Finite-element method (FEM); SPICE; modeling;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2006.875089